Hong Kong Electronics Symposium 2019


 

Organized by: The Hong Kong Institution of Engineers, Electronics Division 


Theme : Engineering the Building Blocks of a Smart City

Date    : 9th April 2019 (Tue)

Time   : 9:00 a.m. - 5:30 p.m.

Venue : 
              Charles K. Kao Auditorium, 1/F, Lakeside 2, 
              Hong Kong Science Park, Pak Shek Kok, 
              Sha Tin, Hong Kong
              香 港 新 界 沙田 香 港 科 學 園
              高錕會議中心 浚湖樓 一樓


Transportation information 

Conference shuttle (complimentary) - TBC   

For details of public transportation or driving to the venue, please check the below link 

http://www.hkstp.org/en/reach-us/getting-here/


Programme Highlight:

The Electronic Division the Hong Kong Institution of Engineers is going to hold the flagship programme "Hong Kong Electronic Symposium 2019 (HKES2019)" on 9 April 2019 in Hong Kong Science Park. The theme of the Symposium is "Engineering the Building Blocks of a Smart City". The topics of interest in HKES2019 cover 5G, Smart Lamp Post, V2X, Smart Grid and Deep Learning etc. As well as technology aspects, market trends and policies to drive Smart Cities will also be discussed. With HKES2019 covering various emerging disruptive technologies, it is the Symposium that should not be missed. 


Registration:

{Please kindly click "Here" for the Symposium pamphlet}


Registration Fee 

$700 (For Member of HKIE and supporting organizations)

$900 (For Non-member)

{Early Bird Registration on or before  18_March_ 2019 _will have discount.(*) } 

          $350 (For Member of HKIE and supporting organizations)
          $450 (For Non-member)
 

          Notes:  Registration fees include attendance at the sessions, a copy of the program book, 
                           tea breaks;  and lunch on 9 April 2019.



Payment Details

{Attention! Registration will only be confirmed on receipt of the full payment}

 (1)  By Hong Kong Cheque 
          Please made cheque payable to 
         
“The Hong Kong Institution of Engineers – Electronics Division”
 
OR

 (2) By Cash and bank –in :
        
Name of bank : The Hongkong and Shanghai Banking Corporation Limited
          Account name : 
The Hong Kong Institution of Engineers – Electronics Division
          Account number : HSBC: 025-344888-012
          Remarks : Please send copy of bank-in slip together with registration form.



Registration 

For registration, please kindly complete the on-line registration form { Click "Here" } with the full payment;   
OR 
completed the HKES 2019 registration form { Click "Here" to download } and; 
send to Ms Veronica Cheng (veronica@pctourshk.com
 / F: (852) 2367 3375 ) with the full payment,

{Please kindly send the cheque / bank-in-slip-copy to the HKES 2019 Conference Secretariat address as below} 

Enquiries

HKES 2019 Conference Secretariat: c/o PC Tours and Travel, 
302, Tower A, New Mandarin Plaza, 14 Science Museum Road, 
Tsimshatsui East, Kowloon, Hong Kong
Tel: (852) 2734 3312/5 ;  Fax: (852) 2367 3375 
Email: 
conference@pctourshk.com

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